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The SP1020 compact office shredder is small in size and suitable for desktops. It can crush paper and a small number of cards. Fine shredding ensures information security. It features low noise and good heat dissipation, is easy to operate and maintain, and is suitable for daily classified destruction in workstations and small offices.

The SP1001 commercial dual-shaft shredder complies with the DIN66399 P4 standard, featuring 4×40mm particle size. It can destroy paper, bank cards, and CDS, with high processing efficiency, durable blade assembly, and anti-card protection. It is suitable for business and confidential office destruction.

The HD200 demagnetizer is compact and weighs 23kg. It can demagnetize hard disks, magnetic tapes and metal workpieces. With a magnetic field of 12,500g /Oe, each erasure lasts less than 20 seconds. The stainless steel body is equipped with copper coils and features intelligent heat dissipation, making it suitable for industrial scenarios.

The SPD750 chip grinding machine is a high-end equipment for precision thinning and polishing of semiconductor chips and wafers. It features micron-level thickness control, supports customization, and meets DIN66399 E7 standards. It operates stably and is suitable for batch precision processing of silicon wafers and wafers.

The SPD350 chip grinding machine is suitable for 2-8 inch wafers, with a production capacity of over 80kg/h, grinding accuracy of ±2μm, Ra < 100nm, and complies with DIN66399 E7. Equipped with an intelligent numerical control system, it takes into account both R&D trial production and mass production, and is used for precise grinding of various semiconductor chips.

The SPD300 chip grinding machine is suitable for 6-12 inch wafers, with a grinding accuracy of ±2μm and a processing efficiency exceeding 20kg/h. It complies with the relevant safety standards of DIN66399, balancing mass production and research and development to ensure high-quality and precise grinding of chips.

The SPD200 chip grinding machine is specially developed for the precision grinding of semiconductor chips and wafers. It is suitable for workpieces ranging from 2 to 8 inches, featuring high precision and stable operation. Equipped with a dust-free sealing system, its precision is on par with imported equipment, and it offers outstanding cost performance.

The SPD150 compact high-precision chip grinding machine can process hard materials such as wafers, chips, CDS, and certificates, with an accuracy of ±2μm and a production capacity of 5KG per hour. It complies with multiple safety standards of DIN66399, is small and intelligent, and is suitable for precision grinding production.