Heavy-duty Dual-axis Electronic Component Disassembly Machine, CD, DVD, USB and Other Electronic Waste Grinding Machine
The SPD350 chip grinding machine is a high-end specialized equipment specially designed for the precise thinning and planar grinding of semiconductor chips and wafers. It is also an indispensable key precision equipment in the core links of chip packaging and wafer manufacturing processes, combining professionalism and versatility. The equipment focuses on high precision, high stability and intelligent automated operation. It can flexibly accommodate the processing of 2-8 inch full-specification wafers. The processing capacity of a single machine exceeds 80 kilograms per hour, with a prominent production capacity advantage. The core processing accuracy is strictly controllable. The grinding thickness accuracy can reach ±2μm. The output size supports conventional specifications of 1×1mm² and 2×2mm² as well as personalized customization. The surface roughness Ra is less than 100nm, and the grinding non-uniformity is less than 5%. It fully meets the strict process standards for chip thinning design, efficient heat dissipation, and long-term high reliability. The whole machine is equipped with an intelligent numerical control system, with the grinding rate precisely adjustable, significantly enhancing production efficiency and effectively reducing the risk of defects such as chipping and micro-damage of workpieces. The equipment strictly complies with the DIN 66399 standard E7 safety level, with both precision and compatibility reaching the maximum. It is widely used in core semiconductor fields such as integrated circuits, power devices, and optoelectronic chips. It can not only adapt to small and medium-sized batch R&D and trial production but also meet the demands of large-scale mass production, helping semiconductor manufacturers achieve efficient and high-quality precision grinding processing. It is the preferred equipment for the precision manufacturing process of semiconductors.
