Portable Grinding Machine, Suitable for CDS, SIM Cards and Chips, with a Highly specialized High-speed Grinding System
The SPD200 chip grinding machine is a professional model developed for the field of semiconductor precision processing. It is mainly targeted at high-precision thinning, leveling and grinding of small and medium-sized wafers and various chips. It is suitable not only for laboratory research and sampling, but also for large-scale medium and small batch production. It is widely applied in the precision grinding processes of wafer thinning, IGBT power devices, optoelectronic chips, and sensor chips, perfectly meeting the requirements of advanced packaging and ultra-thin chip processing. The equipment adopts a high-rigidity and stable body and a precise dual-axis grinding structure, combined with an intelligent numerical control touch control system. Supports processing workpieces ranging from 2 to 8 inches, with a minimum grinding thickness of 25μm. The thickness tolerance is precisely controlled within ±2μm, with an excellent surface roughness, no scratches or warping, significantly ensuring processing consistency and product yield. The whole machine operates smoothly with low vibration and supports 24-hour continuous operation without interruption. It is equipped with a dust-free sealed cavity and a coolant circulation filtration system, meeting the clean production standards of semiconductor workshops. The operation is simple and easy to master, and the maintenance cost is low. Compared with similar imported equipment, its precision is comparable and its cost performance is excellent. It is the core preferred equipment for semiconductor enterprises to improve processing efficiency and reduce production costs.
